| Project Description |
Company Description |
Benefits |
Related Links |
| Consolidate/simplify product design |
Defense electronics |
Reduce parts & options counts, costs |
|
| Improve productivity of DRAM fab |
DRAM mfgr |
Reduce cycle time, Improve tool throughput |
ACM Sep 2000, p.1 |
| Integrated analysis of Cost of Ownership for a
new metrology inspection equipment and its impact throughout the fabrication
process flow |
Equipment supplier |
Equipment performance impact to production |
ACM Mar 2001, p.8 |
| Cost analysis impact of Production Test Time to
Cost of Ownership, Good Wafer Throughput and OEE |
Equipment supplier |
Lower COO of Test Time |
|
| Deploy SEMI Specification for Reliability SEMI E10 and for Productivity SEMI E79 |
Equipment suppliers and Users |
Higher Reliability and Productivity (OEE), Lower
COO |
ACM Mar 1999, p.9 |
| Evaluate Effectiveness of Reliability Improvement
Program |
Equipment supplier and Users |
Equipment Higher Reliability Lower COO |
|
| Training and consulting of simulation
implementation for capacity planning and design of their new factory |
Flat Panel Manufacturer, Semiconductor
Manufacturer |
Data Validation Verification |
ACM Mar 2001, p.1 |
| Analysis of semiconductor DRAM supply chain and
delivery risk |
Internal Use |
Determine minimum inventories |
Supply chain white paper |
| Forecast impacts of a new technology on the cost
and profitability of a semiconductor wafer fab |
Research & Development organization |
validate continued R&D, establish Marketing strategy |
ACM Sep 2001, p.5 |
| Evaluated a passivation material and process technology for overall product cost impact on semiconductor fabrication and final assembly |
Semiconductor Materials Supplier |
Lower Cost |
|
| Assess and improve productivity of manufacturing
operations |
Various sc manufacturers |
Reduce mfg cycle time and costs |
ACM Mar 2000, p.10 |
| Assess relative technical/business
strengths/weakness of SC eqpt mfgrs |
Wall Street |
Guide investment Decisions |
|