Technical Support

Click on any of the bulleted items below for more information

TWO COOL® APPLICATION NOTES
• Addressing Inspection Risk

TWO COOL® FREQUENTLY ASKED QUESTIONS
• Wafer Fabrication
• Assembly and Packaging
• Mask and Reticle Manufacturing
• Board Manufacturing
• Panel Manufacturing
• User Defined Mode

TWO COOL® v3.X TECH ALERTS
• Critical error on v3.1.1 printing Entire Model
• Invalid Version error with non-US non-Unicode settings
• Critical error on v3.1 recent database actions report
• Critical error when launching version 3.0

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• TWO COOL® v2.X TECH ALERTS ARCHIVE

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PRO COOL® APPLICATION NOTES
• PRO COOL® vs. TWO COOL® Comparison
• Modeling the Impact of Rework
• Noncontiguous Process Sequences
• Supplemental Yield Information

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PRO COOL® FREQUENTLY ASKED QUESTIONS
• Process Sequence Cost of Ownership
• Wafer Sort and Final Test

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PRO COOL® TECH ALERTS
• Process Sequence
   • Minimum Cycle Time Report and Chart
   • "Delete a Database Entry" Function
   • Yield Greater Than 100%
   • Inspection Scrap and Equipment Yield
   • Chart Labels
• Wafer Sort and Final Test
   • Test Controller and Handler Module Maximum Process Rates
   • Number of Devices Tested in Parallel

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