Summary:

PRO COOL® for Wafer Sort & Final Test allows estimating the costs of test when more than one device (die or package) is tested in parallel. The number of devices tested in parallel, entered in the test cell requirements screen, is applied to all modules in a test cell. This may not be correct for all modules, especially for modules not impacted by test time.

Workaround:

TWO COOL® requires that the throughput at capacity per system be set for each module. This value may be adjusted to compensate for an unequal number of devices tested in parallel.

TPT_adj = (TPT_tool x Actual)/Devices_par

where:

TPT_adj= Corrected throughput rate
TPT_tool= Original tool throughput rate
Actual = Actual number of devices processed in parallel (may be 1)
Devices_par= PRO COOL® input for number of devices tested in parallel

Example: If the number of die probed in parallel is set to 2 and an off-line inker processes 1 die at a time, the throughput at capacity per system would be set to 1/2 the actual throughput rate.

Techalert 1-9907

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