Wright Williams & Kelly
TECHNICAL ALERT #6 FOR ALL USERS OF TWO COOL® FOR ASSEMBLY AND PACKAGING
It has been determined that the wire bonder throughput calculator generates an incorrect answer for substrates that are not two columns by one row. This leads to an underestimation of throughput for all non-2x1 substrates. This will be corrected in TWO COOL® v2.1.1 which is expected to be released in February 1996.
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